The RELIFE TF1 Mini is a high-temperature tempered glass insulating pad specially designed for smartphone motherboard repairs. Compact, practical, and durable, it is an essential tool for technicians specializing in micro-soldering and integrated circuit repair.
Key Features:
Mini and Portable Size: Suitable for small mobile phone motherboards, ideal for chip removal and installation operations (CPU, memory, hard drive, etc.).
Wide Compatibility: Suitable for a wide range of electronic components: ICs, chips, CPUs, hard drives, etc., for versatile and efficient repairs.
Premium Material: Made of high-quality silicone, offering resistance to wear, high temperatures (up to 500°C), corrosion, and burns, while protecting hands during work.
Internal Bevel Design: Ensures precise and stable component clamping, suspends the motherboard in the air to reduce heat dissipation by conduction, allowing for rapid desoldering without damaging the circuits.
High-strength tempered glass panel: Will not warp under prolonged heat, even above 500°C, ensuring optimal durability under intensive use.
The RELIFE TF1 Mini is the ideal solution for demanding professionals seeking a reliable, secure, and durable support for all precision electronic repair operations.